- Home
-
Products
- Functional Crystals
- Crystal Substrates
- Sputtering Targets
- Powder, Sputtering Sources
- Metal Crystals
- Coated Wafers
- Glass/Ceramic Substrates
- Mat. Processing, Equipment Service
- Services
-
Application
- Partner
- Media
- Contact Us
- About Us
- Home
- Products
- Glass/Ceramic Substrates
- Al2O3 Ceramic
- Functional Crystals
- Crystal Substrates
- Sputtering Targets
- Powder, Sputtering Sources
- Metal Crystals
- Coated Wafers
- Glass/Ceramic Substrates
- Mat. Processing, Equipment Service
Al2O3 Ceramic
Although the thermal conductivity of Al2O3 ceramic substrate is not high (20W / m.k), it has become the most widely used ceramic substrate because of its relatively simple production process, low cost and low price.
Alumina Ceramic Substrate
Ceramic substrate, also known as ceramic substrate, is a sheet material based on electronic ceramics to form a supporting base for membrane circuit components and external fitting components. Ceramic substrate has the main advantages of high temperature resistance, high electrical insulation performance, low dielectric constant and dielectric loss, large thermal conductivity, good chemical stability, similar to the thermal expansion coefficient of components, but the ceramic substrate is brittle, the substrate area is small and the cost is high.
The ceramic substrate materials actually produced, developed and applied include Al2O3, AlN, SiC, BeO, BN, zirconia and glass ceramics.
Although the thermal conductivity of Al2O3 ceramic substrate is not high (20W / m.k), it has become the most widely used ceramic substrate because of its relatively simple production process, low cost and low price
Alumina ceramic substrate is generally prepared by tape casting method. 96% alumina ceramic substrate material is added with appropriate mineral raw materials as flux. The firing temperature is as low as 1580 ℃ ~ 1600 ℃, and the product density can reach more than 3.75g/cm3. For products with high dimensional accuracy requirements, laser processing can be used to scribe and punch holes on the substrate after firing, with an accuracy of ± 0.05mm.
Purity: 96%
Color: milky white
Size: 100x100x1 Within 0mm, it can be cut according to customer's requirements
Surface roughness: < 0.01um (after polishing)< 1um (roughcast)
Parameters | Unit | A476T | |
Density | g/cm3 | 3.78 | |
Hardness(HV) | GPa | 13.9 | |
Flexural Strength | GPa | 380 | |
Thermal Conductivity | W/m.K | 26 | |
Thermal Expension Coefficient(40~400°) | m/K | 7.2x10-6 | |
Dielectric Constant | @1MHZ | 9.6 | |
Dielectric Loss ngle | @1MHZ | 3.0x10-4 | |
Volume resistivity | @25℃ | Ohm.cm | >1014 |
@300℃ | Ohm.cm | 1.0x1010 | |
@500℃ | Ohm.cm | 1.0x108 |
